Product Introduction
This equipment is mainly used to deal with all kinds of special-shaped parts. It has the characteristics of flexible and controllable process parameters and low temperature. It is used for plasma cleaning, etching, coating and surface modification.
Specification
| Item NO. | TS-PL30 |
| Power Frequency | 40KHz/13.56MHz（Optional） |
| Volume | 30L |
| Power | 0~500W（Adjustable） |
| Cavity size(mm) | 300*300*300 |
| Layer | 7 |
| Overall size | 650W*700D*1400H |
| Vacuum pump | Oil pum/dry pump + Roots combination （Optional） |
| Vacuum degree | 5~100Pa（Adjustable） |
| Material of capacity | 316 stainless steel/imported aluminum alloy（Optional） |
| Gas flow control | 0~500SCCM(MFC±2%) |
| Gas channel | Two way(addability)：Ar/N2/H2/CF4/O2 |
| Plasma generator | 40KHz/13.56MHz（Optional） |
| Tempture of capacity | ＜30 degree |
| Control mode | PLC+Touch screen |
| Software of system control | Independent |
| Electrode ceramic | Imported high frequency ceramics |
Features
1. Vacuum plasma cleaning machine chamber, power supply, vacuum pump and other accessories can be customized according to the actual cleaning materials. Compared with atmospheric plasma, it has the characteristics of free adjustment of cleaning process parameters, low temperature and comprehensive cleaning.
2. Widely used in activation, deplating, modification, etching, improving adhesion and cleaning and other functions.At present,it is the most environmental protection, the most energy saving, good effectiveness of the ideal equipment in the cleaning industry.
Etching: It is very useful for the removal of photoresist polyimide residues and coatings based on silicides.
Adhesion enhancement: adding chemical groups with strong activation ability to the matrix to improve the adhesion of the adhesive.
Cleaning: Removal of optical material contamination and removal of organic residues, oxidation and metal salts on the material contamination.
Activation: It can cause the surface of the substrate to form the required chemical polar bonds;
Deplating: Remove metal and other materials from the treated substrate to produce various products.
Product Application
