Product Introduction
This machine is a standard off-line vacuum plasma cleaning machine. Its functions include surface activation and modification, increase adhesion, and handle various electronic materials, including plastic, metal or glass, etc. It is used in all walks of life.
Specification
| Item NO. | TS-PL110 |
| Power Frequency | 40KHz/13.56MHz （Optional） |
| Volume | 110L |
| Power | 0-500W（Adjustable） |
| Cavity size(mm) | (L*W*H)500*450*500mm |
| Layer | 15 |
| Overall size | (L*W*H)1100*1030*1680mm |
| Vacuum pump | Oil pum/dry pump + Roots combination （Optional） |
| Vacuum degree | 5-100pa（Adjustable） |
| Material of Cavity | 316 stainless steel/imported aluminum alloy（Optional） |
| Gas flow control | 0-500SCCM(MFC±2%) |
| Gas channel | Two way(addability)：Ar/N2/H2/CF4/02 |
| Plasma generator | 40KHz/13.56MHz（Optional） |
| Tempture of capacity | ＜30℃ |
| Control mode | PLC+Touch screen |
|
Software of system control |
Independent |
| Electrode ceramic | Imported high frequency ceramics |
Etching: Useful for the removal of photoresist polyimide residues and silicid-based coatings;
Adhesion enhancement: The addition of highly active chemical groups to the substrate to improve the adhesive's adhesion;
Cleaning: Removal of optical material contamination and removal of organic residues, oxidation and metal salts on the material contamination;
Activation: It can cause the surface of the substrate to form the required chemical polar bonds;
Deplating: To remove metal and other materials from the treated substrate to produce various products.
Product Application
